Production process of NTC thermistor.Infrared Body Sensing Module

　　Raw material testing

　　All raw materials must be tested upon receipt to confirm whether their physical and electrical properties are acceptable. A unique ID # has been assigned and used for batch traceability.

　　Mixing of raw materials

　　The manufacturing of NTC thermistors begins with the precise mixing of raw materials into an organic adhesive solution. These raw materials are powdered Transition metal oxides, such as manganese, nickel, cobalt and copper oxides. Other stabilizers are also added to the mixture. Mix oxides and adhesives using a wet process called ball milling. During the ball milling process, mix the materials and reduce the particle size of the oxide powder. The completed uniform mixture has the consistency of a thick slurry. The exact composition of various metal oxides and stabilizers determines the resistance temperature characteristics and resistivity of fired ceramic components.

　　Magnetic tape casting

　　Use scraper technology to distribute the "slurry" on the moving plastic carrier sheet. By adjusting the height of the scraper above the plastic carrier, the speed of the carrier, and by adjusting the viscosity of the slurry, the exact material thickness can be controlled. When the casting material is dried on a flat casting strip through a long tunnel furnace at high temperature, it is dried. The obtained "green" tape has ductility and is easy to shape. Then conduct quality inspection and analysis on the tape. The casting thickness range of this thermistor strip is wide, from 0.001 "to over 0.100", depending on the specific component specifications.

　　Wafer formation

　　Now the casting strip can be formed into a chip. When thin material is needed, simply cut the tape into small squares. For thicker chips, cut the tape into squares and stack them one on top of the other. Then, these stacked chips are laminated together. This enables us to produce wafers of almost any thickness. Then, the wafer undergoes additional quality testing to ensure high uniformity and quality. Subsequently, the chip undergoes a binder burn cycle. This process removes most of the organic adhesive from the chip. Maintain precise time/temperature control during the adhesive burn out cycle to prevent adverse physical stress on the thermistor chip.

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