New miniature FIR sensor

　　Based on Melai core mature FIR technology - using the principle that every object will emit thermal radiation. The ultra-small integrated thermonile CMOS IC is a complete solution with sensor components, signal processing, digital interfaces and optics in a 3x3x1mmQFN package that can be quickly and easily integrated into a variety of modern applications.

　　The high-precision device provides a high level of thermal stability while undergoing thermal gradients and rapid temperature changes, addressing a well-known weakness of existing infrared sensors. In addition, it offers Mount type (SMD) packages compatible with standard PCB assembly technologies.

　　The first civilian-grade product has now been released. Subsequent MLX90632 products will target very demanding applications such as medical care.

　　Smart device manufacturers can differentiate their products with accurate temperature measurements. The optical lens is integrated into this product to reduce the Angle of view (FOV), thus achieving higher working distance and more accurate measurement accuracy.

　　It can be used in any application where accurate temperature measurements are necessary, especially in thermally dynamic environments and where space availability is limited. So potential applications include white and black appliances, smart thermostats, indoor temperature monitoring in server rooms, or integration into portable electronic devices such as tablets and smartphones.

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