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source:Industry News release time:2022-11-23 Hits: Popular:Infrared sensing module
Raw material testing
All raw materials shall be tested after receiving to confirm whether their physical and electrical properties are acceptable. A unique ID # is assigned and used for batch traceability.
Raw material mixing
The manufacture of NTC thermistors begins with the accurate mixing of raw materials into an organic binder solution. These raw materials are transition metal oxides in powder form, such as manganese, nickel, cobalt and copper oxides. Other stabilizers are also added to the mixture. The oxide and binder are mixed using a wet process called ball milling. In the ball milling process, the materials are mixed and the particle size of the oxide powder is reduced. The finished homogeneous mixture has the consistency of the thick slurry. The exact composition of various metal oxides and stabilizers determines the resistance temperature characteristics and resistivity of fired ceramic components.
Tape casting
The scraper technology is used to distribute the "slurry" on the moving plastic carrier sheet. The exact material thickness is controlled by adjusting the height of the scraper above the plastic carrier sheet, the carrier sheet speed and the slurry viscosity. When the casting material is dried on the flat casting belt through a long tunnel furnace at high temperature, it is dried. The resulting "green" tape is malleable and easy to form. Then carry out quality inspection and analysis on the tape. The cast thickness of this thermistor tape can range from 0.001 "to more than 0.100" depending on the specific component specification.
Wafer formation
The cast strip can now be formed into a wafer. When thin materials are needed, simply cut the tape into small squares. For thicker wafers, cut the tape into squares and stack one on top of the other. These stacked wafers are then laminated together. This allows us to produce wafers of almost any thickness. The wafer is then subjected to additional quality testing to ensure a high degree of uniformity and quality. Then, the chip is burned out. This process removes most of the organic binder from the wafer. Precise time/temperature control is maintained during the binder burn out cycle to prevent adverse physical stresses on the thermistor chip.
sinter
The wafer is heated to a very high temperature in an oxidizing atmosphere. At these high temperatures, the oxides react with each other and fuse together to form a spinel ceramic matrix. During the sintering process, the material is densified to a predetermined degree, and the grain boundary of the ceramics is allowed to grow. The precise temperature distribution is maintained during the sintering process to avoid chip breakage and to ensure the production of finished ceramics capable of producing parts with uniform electrical properties. After sintering, the quality of the wafer shall be checked again, and the electrical and physical characteristics shall be recorded.
electrode
The thick film electrode material is used to obtain ohmic contact with the ceramic chip. Depending on the application, the material is usually silver, palladium silver, gold or platinum. The electrode material consists of a mixture of metal, glass and various solvents, and is applied to two opposite surfaces of the chip or chip by screen printing, spraying or brushing. In the thick film belt furnace, the electrode material is fired onto the ceramic, and an electrical connection and a mechanical connection are formed between the ceramic and the electrode. Then check the metallized chip and record the properties. Precise control of the electrode process ensures excellent long-term reliability of components produced on wafers.
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