Multi core parallel port NTC sensor

　　The multi-core parallel port NTC sensor is made by the most advanced high-temperature solid state process. The powder preparation, high-temperature sintering, slicing, electrode preparation, analysis and testing, etc. have passed the domestic leading high-performance equipment. The chip surface is gold plated or silver plated high temperature resistant high-precision chip, which has good heat resistance cycling capability, stable performance and other characteristics. The temperature range of NTC bare chip is: - 50 ° C to 300 ° C. NTC chip lead welding process can be used: insert tin dipping, electronic pressure welding, manual welding, blue film packaging NTC chip binding.

　　Product mechanical properties:

　　Both sides of the silver electrode should be suitable for welding with the lead wire and have good contact

　　Adhesion of silver electrode: after welding the lead wire, the silver layer shall not be separated by applying 0.5 pound tension.

　　General product specifications:

　　Resistance value of bare core NTC thermistor: 1K Ω, 5K Ω, 10K Ω, 50K Ω, 100K Ω, 150K Ω, 200K Ω, 230K Ω, 500K Ω, etc

　　Chip thermistor B value: 3435, 3950, 3977, 3470, 3600, 3380, 4100, 4200, etc

　　Dimensions of chip thermistor: chip side length 1.0 * 1.0 width * 0.5 thickness, chip side length 0.5 * 0.5 width * 0.25 thickness, etc

　　NTC link mode of high-precision small volume chip: welding, tin dipping, binding, etc.

　　Packaging method of bare chip thermistor: bulk and bound with NTC chip in new blue film packaging.

　　The NTC accuracy distribution of the bare film: more than 80% within ± 1%, more than 90% within ± 2%

　　Temperature range of chip NTC: - 60 ℃ to+210 ℃ Time constant: less than 1 second

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